Rorke Data The Galaxy 65 Especificações descarregar pdf (Página 19)

Chapter 1: Introduction

Subsystem Components

1-7

• Cooling module: The redundant cooling modules are used to ventilate the

subsystem and to reduce the temperature within the subsystem. The 12-bay model

has an additional cooling module installed in the bottom module bay.

NOTE:

Each of the power supplies on the sides of the enclosure houses one cooling module

in a retrievable canister. When a power supply is removed, the cooling module is also

removed. Therefore, replace the power supply unit as fast as possible whenever it

becomes necessary. Cooling modules can be independently removed from the chassis

without affecting PSU operation.

1.1.3.6 Backplane Board

An integrated back-plane board separates the front and rear sections of the 12 bay Galaxy

subsystems. This PCB board provides logic level signal traces and low voltage power

paths. It contains no user-serviceable components.

1.2. Subsystem Components

1.2.1 LCD Panel

Figure 1-11: Opening the Front Handle

The LCD panel shown in Figure 1-11 consists of a 16 characters x 2 rows LCD screen

with push buttons, a mute button, and LED status indicators. The LCD front panel

provides full access to all array configurations and monitoring. After powering up the

subsystem, the initial screen will show the subsystem model name. A different name can

be manually assigned to the subsystem or to different drive arrays. This will enable easier

identification in a topology consisting of numerous arrays.

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Rorke Data The Galaxy 65 Especificações Página 19